Rugged VPX Single Board Computers, Intel

and Power PC Architecture

MPC8640
3U VPX MPC8640 Dual Core Single Board Computer

3U VPX Single or Dual Core Freescale Single Board Computer

Model TIC-PPC-VPX3a


Ruggedize your SBC or bundle it in a fully integrated package including mezzanine options and OS integration sold and supported under a single assembly number.

  • 1GHz Freescale MPC8640 Processor
  • Standard, Extended and Conduction Cooled versions available
    • -0C to +55C (Standard)
    • -20C to +65C (Extended)
    • -40C to +75C (Rugged and Conduction Cooled)
  • 1MB of L2 integrated cache
  • Up to 2GB DDR2 SDRAM with ECC
  • Up to 8GBof soldered NAND flash
  • One RS232/422/485 interface
  • Dual 10/100/1000 Ethernet ports (as RJ45 BT front panel ports or 1000Kx ports via P1
  • Dual 10/100/1000 Ethernet ports (as 1000BT or 1000Kx via P1
  • Eight lanes available as one PCIe x 8 or two PCIe x 4 or four PCIe x 2 links
  • Four lanes available as one PCIe x 4 or one SRIO x 4 link
  • For front end processing needs required in high bandwidth VPX applications, see our 3U VPX Model TIC-FEP-VPX3a Virtex 5 based communications processor.

Also available as a bundle with operating systems, storage, and transition I/O.  See our AppliPak "Boot and Go" SBCs. 

Intel Atom Processors
TR A40/30x Intel Atom 3U VPX Single Board Computer
TR A40/30x Intel Atom 3U VPX Conduction Cooled Single Board Computer


3U VPX Intel Atom Dual Processor

Model TR A40/30x

  • 1.6GHz Low Power Intel® Atom Processors Z530
  • Extended temperature versions
    • -0C to +55C (N Series)
    • -40C to +85C (RC Series)
    • Conduction cooled version
  • 512 KB L2 Cache
  • 2GB DDR2-533 SDRAM
  • Dual SATA 3 interfaces
  • Dual RS232/422/485 interfaces
  • Dual USB 2.0 interfaces
  • Dual 10/100/1000 Mbps Ethernet interfaces or 2 x 1000 Mbps IEEE803.2z SerDes (1000 Base BX) ports
  • 1 x XMC module interface with rear I/O, x4 PCIe
  • Configurable PCIe fabric interface supports
    • 8 x1 PCIe ports, 1 x4 and 4 x1 PCIe ports, or 2 x4 ports
    • option for one transparent link
  • Optional rear transition module
  • Support for Linux®, Windows® XP, Windows® XP Embedded, QNX®, and VxWorks
  • For front end processing needs required in high bandwidth VPX applications, see our 3U VPX Model TIC-FEP-VPX3a Virtex 5 based communications processor.

Also available as a bundle with operating systems, storage, and transition I/O.  See our AppliPak "Boot and Go" SBCs. 

 

Intel Core 2 Duo Processors

 

3U VPX SBC Intel Core 2 Duo SL9380
Intel Core 2 Duo Conduction or Air Cooled SL9380 Single Board Computer
Model TIC-DC2-VPX3a
  • SL9380 1.8 or 1.2GHz Core 2 Duo microprocessor
  • Advanced power management features
  • Low power / high energy efficiency Intel micro-architecture
  • Up to 4 GB soldered Nand Flash
  • Up to 2GB of DDRII 400 SRAM
  • Temperature sensor and monitoring
  • VME64x with 2eSST (Tsi148)
  • Communications
    • 8 lanes available as one PCIe x 8 or two PCIe x 4 links
    • Dual Gig E ports available as 2 x 1000BT interfaces or 2 x 1000KX interfaces on P1
    • 2 RS232 UART
    • 2 USB2 ports
    • 2 SATA ports
    • 8 GPIO
    • I2C bus
  • Accessories
    • 3U rear transition module
    • Engineering kit for debug: JTAG/COP, console etc.
  • Available in standard, extended, rugged and conduction cooled versions
  • Linux distribution is provided. Contact Elm regarding Windows and VxWorks support.
  • For front end processing needs required in high bandwidth VPX applications, see our 3U VPX Model TIC-FEP-VPX3a Virtex 5 based communications processor.

Also available as a bundle with operating systems, storage, and transition I/O.  See our AppliPak "Boot and Go" SBCs. 

 

Download Datasheet

 

 

TR 501/36x Intel Core 2 Duo 3U VPX Single Board Computer
TR 501/36x Intel Core 2 Duo 3U VPX Conduction Cooled Single Board Computer


3U VPX Intel Core 2 Duo Processor

Model TR 501/36x

  • 1.86GHz Intel® Core 2 Duo Processors GS45
  • Extended temperature versions
    • -0C to +55C (N Series)
    • -40C to +85C (RC Series)
    • Conduction cooled version
  • Up to 8GB DDR2-1066 SDRAM
  • 1066MHz front side bus
  • 6MB last level cache shared between cores
  • Dual SATA 3 interfaces
  • One RS232/422/485 interfaces
  • Dual USB 2.0 interfaces
  • Dual 1000 Mbps IEEE802.3z SerDes (1000 Base-BX) ports. Option for one SerDes port plus one Gig E port
  • 1 x XMC module interface with rear I/O:
    • XMC module interface ( x4 PCIe)
    • XMC rear I/O P2w1-X24s+X8d+X12d
  • Configurable PCIe fabric interface supports
    • 8 x1 PCIe ports, 2 x4 PCIe ports, 1 x4 + 4 x1 PCIe ports or a 1 x8 PCIE port
  • Optional rear transition module
  • Optional N-series front panel console module allows extra I/O;
    • 1 x USB 2.0, 1 x RS232, 1 x 10/100 Ethernet port and 1 x VGA port
  • Support for Linux®, Windows® XP, Windows® XP Embedded, Windows Server 2003, Windows Server 2008, QNX®, Solaris and VxWorks
  • For front end processing needs required in high bandwidth VPX applications, see our 3U VPX Model TIC-FEP-VPX3a Virtex 5 based communications processor.

Also available as a bundle with operating systems, storage, and transition I/O.  See our AppliPak "Boot and Go" SBCs.